Two Components Epoxy Resin Electronic Potting Compound

Product Description

Model NO.	WD30001AB	Curing Time	25 Centigrade, 2-24h
Cured Performance	Even, Smooth, No Bubbles	Hardness	55 Plus & Minus 10
Tensile Strength	>1.0	Elongation at Break(%)	Greater Than or Equal to 150
Linear Expansion Coefficient	Less Than or Equal to 220	Thermal Conductivity	Greater Than or Equal to 0.45
Water Absorption	Less Than or Equal to 0.1	Insulation Strength	Greater Than or Equal to 18
Volume Resistivity	>1.0×10¹¹	Surface Resistivity	>1.0×10¹⁰
Transport Package	Barrel	Specification	25kg, or customized available
Trademark	SWETE	Origin	China

Description

Excellent comprehensive characteristics, such as small shrinkage and residual stress during curing, good elasticity, toughness, excellent electrical properties, no deformation, no corrosion, excellent permeability, no cracking during cold and hot cycles, etc. It is suitable for encapsulating various electronic components.

Usage

It is suitable for automobile electrical appliances, motorcycle electrical appliances, relays, water heater control boards, electric vehicle controllers, circuit boards, various electronic components, power modules, inverters, filters, arrester modules, etc.

Characteristics

Item Index Model		WD090300A	WD090300B	WD0903001A	WD0903001B
Before curing	Appearance	Black Liquid	Yellow-brown liquid	Black Liquid	Yellow-brown liquid
	Viscosity (40ºC, mPa.s)	800-1800	20-85	800-1800	20-150
	Bubble experiment	bubbles burst out in 5-9 min
	Available time (25ºC, min)	≥10
	Gel time (150ºC, s)	Negotiate		Negotiate
After curing	Physical Properties
	Curing time	25ºC2-24h
	Performance of curing samples	Even, smooth, with no bubbles.
	Hardness (shore A)	55±10		50±10
	Tensile strength (Mpa)	>1.0		>1.0
	Elongation at break (%)	≥150		≥150
	Linear Expansion Coefficient (ppm/ºC)	≤220		≤220
	Thermal Conductivity (W/m.K)	≥0.45		≥0.45
	Water Absorption ( 23ºC24h,%)	≤0.1		≤0.1
	Flame-retardant (UL-94)	Negotiate		Negotiate
	Electrical Properties
	Insulation Strength (KV/mm)	≥18		≥18
	Volume Resistivity (Ω/cm)	>1.0×10¹¹		>1.0×10¹¹
	Surface resistivity (Ω/cm)	>1.0×10¹⁰		>1.0×10¹⁰

Two Components Epoxy Resin Epoxy Electronic Potting Compound Glue Electronic Polyurethane Potting Adhesive

Characteristics

It has excellent comprehensive characteristics, such as small shrinkage and residual stress during curing, good elasticity, toughness, excellent electrical properties, no deformation, no corrosion, excellent permeability, no cracking during cold and hot cycles, etc. It is suitable for encapsulating various electronic components.

Ratio
100:13-20

Package

Part A: 25kg /barrel
Part B: 10kg /barrel

Storage Conditions

The product should be sealed in its original packaging container and stored in a dry and ventilated place. In an environment of 18-40ºC, the shelf life is 6 months. If the shelf life is exceeded, analysis is required to determine whether it is still valid.

Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.