Epoxy Resin Potting Compound Adhesive AB Glue for Electronic Bridge Stack

Epoxy Resin Potting Compound Adhesive AB Glue for Electronic Bridge Stack

Basic Information

Model NO.WD90200ALinear Expansion CoefficientLess Than or Equal to 27
Thermal ConductivityGreater Than or Equal to 0.75Insulation StrengthGreater Than or Equal to 20
Dielectric ConstantLess Than or Equal to 3.8Volume ResistivityGreater Than or Equal to 1.0×1016
Water AbsorptionLess Than or Equal to 0.7Transport PackageBarrel
Specification25kg, or customized availableTrademarkSWETE
OriginChinaProduction Capacity50000tons Per Year

Product Description

Electronic bridge stack, high-end heat dissipation regulator, automobile and motorcycle sensors, and other electronic product packaging. It has good heat dissipation, a small linear expansion coefficient, strong cracking resistance, good insulation performance, excellent surface gloss, and good processability.

Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack

Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack

 

Application

Electronic bridge stack, high-end heat dissipation regulator, automobile and motorcycle sensors, and other electronic product packaging.

Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack

Characteristics

Good insulation performance, good physical properties, excellent surface gloss, good processability, and good crack resistance. Test data, as bellow:

One-component performance test data:

AppearanceMain agent ABlack viscous liquid
Curing agent BBrown viscous liquid
DensityMain agent A1.84-1.90
Curing agent B1.68-1.74
ViscosityMain agent A40000-80000
Curing agent B4500-9500

Property after curing (25ºC, 5-6 hours curing)

Glass Transition Temperature (ºC)≥160
Linear Expansion Coefficient(ppm/k, lower than the average of Tg )≤27
Water Absorption(%, 100ºC/24h)≤0.7
Thermal Conductivity (W/mK)≥0.75
Insulation Strength (KV/mm)≥20
 Dielectric Constant (50Hz)≤3.8
Volume Resistivity (Ω/cm)≥1.0×1016

Mixing Ratio

100:80-20

 

Package

Component A: 25kg /barrel
Component B: 5kg /barrel

Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack
Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack
Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge StackEpoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack
Storage Conditions

The product should be sealed in its original packaging container and stored in a dry and ventilated place. In an environment of 18-40ºC, the shelf life is 6 months. If the shelf life is exceeded, analysis is required to determine whether it is still valid.Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack

Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack
Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.

Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack
Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack
Epoxy Resin Potting Compound Adhesive Ab Glue for Electronic Bridge Stack

 

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