Exceptionally High Thermal Conductivity for Superior Electronics Organic Silicone Encapsulant

Exceptionally High Thermal Conductivity for Superior Electronics Organic Silicone Encapsulant

Key Attributes

CAS No.NONEPlace of OriginGuangdong, China
Main Raw MaterialEpoxyUsageSealed electronics
Other NamesSilicone encapsulation resinMFNONE
EINECS No.NONEClassificationDouble Components Adhesives
Brand NameSWETEModel NumberSW-383-32
TypeTwo ComponentProduct nameHigh Thermal Conductive Silicone Potting Resin
Brand SWETEColorPart A is grey, Part B is white
CertificateULMaterialhigh thermal conductivity addition- reaction silicone
Mixing RatioA: B=100:100ComponentTwo Components
Curing time25°C, approx. 6 hours initial curingStorage20kg sealed iron drums
Product TypePotting Resin

 

No
Item
Value
1
Other Names
Silicone potting sealant
2
Type
Two-component
3
Usage
Encapsulation of electronic components and protection against water, dust, and leakage. Such as electrical and electronic modules, motors, transformers, power supply modules, rectifier circuits, etc.
4
Features
Two-component addition type silicone potting compound
Thermal class: C
Excellent hardening process, room temperature, or heating vulcanization.

Excellent fluidity can be used for deep curing.
Non-toxic and no corrosive, safe and environmental-friendly

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