Exceptionally High Thermal Conductivity Organic Silicone Encapsulant for Superior Electronics

Exceptionally High Thermal Conductivity Organic Silicone Encapsulant for Superior Electronics

Key Attributes

CAS No.NONEPlace of OriginGuangdong, China
Main Raw MaterialSiliconeUsageConstruction, Sealed electronics
Other NamesSilicone encapsulation resinMFNONE
EINECS No.NONEClassificationDouble Components Adhesives
Brand NameSWETEModel NumberSW-383-32
TypeTwo ComponentsSupply Ability50000 Kilogram/Kilograms per Month

 

No
Item
Value
1
Other Names
Silicone potting sealant
2
Type
Two-component
3
Usage
Encapsulation of electronic components and protection against water, dust, and leakage. Such as electrical and electronic modules, motors, transformers, power supply modules, rectifier circuits, etc.
4
Features
Two-component addition type silicone potting compound
Thermal class: C
Excellent hardening process, room temperature, or heating vulcanization.

Excellent fluidity can be used for deep curing.
Non-toxic and no corrosive, safe and environmental-friendly

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