High-temperature Resistant Epoxy Resin Adhesive for Electronic Bridge Stacks

High-temperature Resistant Epoxy Resin Adhesive for Electronic Bridge Stacks

Characteristics:

Good heat dissipation, small coefficient of linear expansion, strong anti-cracking performance, good insulation performance, excellent surface gloss, and good workmanship.

Application:

Electronic bridge stack, high-end heat dissipation regulator, automobile and motorbike sensors, and other electronic product packaging.

Properties before curing:

AppearanceComponent ABlack viscous liquid
Component BBrown viscous liquid
Density(25℃, g/cm³)Component A1.84-1.90
Component B1.68-1.74
Viscosity (40℃, mPa.s)Component A40000-80000
Component B4500-9500

Properties after curing:

Glass Transition Temperature (℃)≥160
Linear Expansion Coefficient(ppm/k, lower than the average of Tg )≤27
Water Absorption(%, 100℃/24h)≤0.7
Thermal Conductivity (W/mK)≥0.75
Insulation Strength (KV/mm)≥20
Dielectric Constant (50Hz)≤3.8
Volume Resistivity (Ω/cm)≥1.0×1016

Mixing Ratio:

100:90

Packaging:

Component A: 10kg/barrel

Component B: 9kg/barrel

Storage conditions:

The product should be sealed in the original packaging container and stored in a dry and ventilated place. The shelf life is 6 months in an 18-40℃ environment. If shelf life is exceeded, analysis is required to determine whether it is valid.
Due to storage conditions, a small amount of precipitation may occur during storage, which is normal, and can be used normally after mixing.

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