High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

Basic Information

TypePower Potting MaterialClassificationDouble Components Adhesives
AdvantageHigh Sealing PropertyShelf Life12 Months
Delivery Time10~15 DaysApplicationSealing
Main Raw MaterialEpoxyUsageElectronics
Transport PackageBarrelSpecification25kg/barrel (customized available)
TrademarkSWETEOriginGuangdong, China
Production Capacity150 Ton/Tons Per Month

 

Product Data

ITEM
WD870
Appearance

A: Black viscous liquid

B: White viscous liquid
Viscosity, cps,25ºC
A&B: 3500±1000
Density (g/cm³)
1.63±0.02
Mixing Ratio
100:100
Viscosity after mixing, 4# rotor, cps, 25 ºC
3500±1000
Operation time after mixing cps. 25ºC(min)
40±10
After mixing, table dry time, cps, 25ºC
80±20
Hardening conditions
25ºC:3-5 hr or 80ºC:30mins
Feature after cured
Appearance
Gray, flexible elastomer
Hardness (Shore A)
50±5
Thermal conductivity, W/mK
1.0
Linear expansion coefficient, K-1, ppm
210
Dielectric strength, kV/mm, 25ºC
25
Volume resistance, DC 500V, Ω CM
1.1*1014
Loss factor(1 MHz)
0.009
Dielectric constant (1 MHz)
3.00
Temperature range, ºC
-60~200
Flame Resistance, UL-94
V-0

 

Usage

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
Application

It is supplied in lot-matched Part A and B kits in separate containers.
During the long storage periods, some filler may settle at the bottom of the containers and should be individually homogenized before use.
The two components should be thoroughly mixed using a weight ratio of 1:1 until the mixture has a uniform color. Vacuum de-airing is recommended. A residual pressure of 10-20 mm mercury applied for 5-10 minutes will sufficiently de-air the material.
Package
Part A: 25kg/barrel, 200kg/Drum.
Part B: 25kg/barrel, 200kg/Drum.
High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

 

Factory and Production

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.

Delivery Time

below 2000KGs   7-15days
5000-20000KGs   15-25days

Shipping way

Samples: DHL, Fedex, TNT, etc.
Cargo: By sea, by air, by railway, etc.

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

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